- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
Patent holdings for IPC class H01R 12/88
Total number of patents in this class: 229
10-year publication summary
24
|
30
|
24
|
19
|
20
|
20
|
21
|
15
|
14
|
3
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Kyocera Corporation | 12735 |
20 |
Japan Aviation Electronics Industry, Limited | 1585 |
19 |
DDK Ltd. | 52 |
15 |
Fujikura Ltd. | 2777 |
14 |
Molex, LLC | 1792 |
9 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
8 |
Foxconn Interconnect Technology Limited | 1034 |
7 |
Intel Corporation | 45621 |
6 |
Samsung Electronics Co., Ltd. | 131630 |
5 |
Dai-Ichi Seiko Co., Ltd. | 289 |
5 |
Hirose Electric Co., Ltd. | 325 |
5 |
TE Connectivity Solutions GmbH | 2580 |
5 |
Advanced Micro Devices, Inc. | 5326 |
4 |
Iriso Electronics Co., Ltd. | 184 |
4 |
J.S.T. Mfg. Co., Ltd. | 115 |
4 |
Lotes Co., Ltd. | 346 |
4 |
WAGO Verwaltungsgesellschaft mbH | 462 |
4 |
Omron Corporation | 6968 |
3 |
Amphenol Corporation | 748 |
3 |
Enplas Corporation | 900 |
3 |
Other owners | 82 |